COPYRIGHT (C) 2020 TESSOLVE SEMICONDUCTOR PVT. LTD., ALL RIGHTS RESERVED
THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF TESSOLVE SEMICONDUCTOR PVT. LTD.
AND SHALL NOT BE DISTRIBUTED AND SHALL NOT REPRODUCED OR DISCLOSED IN WHOLE OR IN PART WITHOUT 
PRIOR WRITTEN PERMISSION OF TESSOLVE SEMICONDUCTOR PVT. LTD.
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CUSTOMER		-	TI         	
CARD NAME		-	Camera_Motor_Module        	
PART NUMBER		-	Camera_Motor_Module	    	
DATE                   	-	04-MAY-2020
DESIGNED AT     	-	Tessolve Semiconductor Pvt. Ltd.
CONTACT E-Mail ID	-	engineering_cbe@tessolve.com
GERBER FORMAT 		-	RS274X , ENGLISH  2,5 LEADING
DRILL FORMAT 		-	EXCELLON ENGLISH  2,5 TRAILING
PACKAGE NAME   		-	TS23188AC0_Camera_Motor_Module_E1_FAB_20200504.zip

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LIST OF FILES INSIDE PACKAGE:

ELECTRICAL LAYERS :

Camera_Motor_ModuleE1.GTL	-	Layer 1 (Top / Primary Side)
Camera_Motor_ModuleE1.G1	-	Layer 2 (Ground Plane Negative)
Camera_Motor_ModuleE1.G2	-	Layer 3 (Power Plane Positive)
Camera_Motor_ModuleE1.GBL	-	Layer 4 (Bottom / Secondary Side)


NON ELECTRICAL LAYERS :

Camera_Motor_ModuleE1.GTS	-	Solder Mask Top
Camera_Motor_ModuleE1.GBS	-	Solder Mask Bot
Camera_Motor_ModuleE1.GTO	-	Silk Screen Top
Camera_Motor_ModuleE1.GBO	-	Silk Screen Bot
Camera_Motor_ModuleE1.GM1	-	Board Outline
Camera_Motor_ModuleE1.GD1	-	Fabrication Drawing



DRILL LAYERS :

Camera_Motor_ModuleE1-NonPlated.TXT	-	Non Plated through holes drill file
Camera_Motor_ModuleE1-Plated.TXT	-	Plated through holes drill file



OTHER FILES :

Fabrication Testpoint Report for Camera_Motor_Module_PCB.ipc 	- IPC-D-356 Netlist 
Layers.pdf	- PDF Plots of all layers
Fab.pdf		- PDF of Fabrication Drawing
Readme_Fab.txt	- This file
